
International Conference on Planarization/CMP Technology 2009
November 19-21, 2009
JAL Resort Sea Hawk Hotel, Fukuoka (Fukuoka, Japan)

“Polishing” is one of the processing techniques which human beings acquired as the first technique for fabrication of tools and instruments. Nowadays, polishing technique has developed as one of the most important key technology for ULSI fabrication process. Chemical Mechanical Polishing (CMP) technology enables ULSI’s outstanding improvements with multi-layered interconnect structure and Cu/Low-k interconnects. Furthermore, CMP technology creates a huge market as more than $ 3 billion USD (year 2007) was spent on CMP machines and consumables. Seeking to further improved ULSI technology and market, CMP technology’s development is the most significant factor. To achieve CMP technology development, it is important to sit down with all the CMP engineers and to discuss from fundamental research to application technology and from slurry and polishing pad to CMP machine.
Since PacRim-CMP 2004 was held in Tokyo, Japan in 2004, we have accumulated the history of joint CMP conferences every year. In Seoul, Korea(PacRim-CMP 2005) in 2005, Foster City, USA(ICPT 2006) in 2006, Dresden, Germany (ICPT 2007) in 2007 and Hsinchu, Taiwan (ICPT 2008) in 2008. In November 2009, the “International Conference on Planarization/CMP Technology 2009” will be held in Fukuoka, Japan, organized by the Japan Planarization-CMP Technical Committee (JSPE). The mission of the conference is to reinforce the foundation of CMP technology and to foresee the route for future technology with high scientific level discussion with the world wide CMP community.
Because of the economical turmoil since 2008 autumn, ICPT 2009 will be a small-scale and compact conference compared with past meetings. However, encountering with such serious economical recession, the conference must be meaningful. We look forward to seeing you in Fukuoka, Japan.
Professor Keiichi Kimura
Kyushu Institute of Technology
Conference Chairperson
